Advanced Interconnects for ULSI Technology Book Information:

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Overview & Summary ofAdvanced Interconnects for ULSI Technology Book

Finding new materials for copper/low k interconnects is critical to the continuing development of computer chips. While copper/low k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

• Book Type :

Higher Education Textbooks

Book Binding :

Paperback

Language :

English

Number of Pages :

ISBN - 10 :

0470662549

Advanced Interconnects for ULSI Technology Published On :

2 Mar 2012

Resource:

Textbooks & Study Guides, Higher Education Textbooks Books for Students, Teachers, Graudates, Professionals and all others

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