Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems) Book Information:

uses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

• Book Type/Genre :

Textbooks & Study Guides

• Book Binding :

Hardcover

• Language :

English

• Number of Pages :

Page count varies on each edition/reprint

• ISBN - 10 :

0387765328

• Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems) Published On :

2009

• Resource:

Textbooks & Study Guides, Higher Education Textbooks Book is recommended for Students, Teachers, Graduates, Professionals, and all bibliophiles

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